Part Details for IDT7200L30JGB by Integrated Device Technology Inc
Overview of IDT7200L30JGB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for IDT7200L30JGB
IDT7200L30JGB CAD Models
IDT7200L30JGB Part Data Attributes
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IDT7200L30JGB
Integrated Device Technology Inc
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Datasheet
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IDT7200L30JGB
Integrated Device Technology Inc
FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QFJ | |
| Package Description | QCCJ, LDCC32,.5X.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 30 ns | |
| Additional Feature | RETRANSMIT | |
| Clock Frequency-Max (fCLK) | 25 MHz | |
| Cycle Time | 40 ns | |
| JESD-30 Code | R-PQCC-J32 | |
| JESD-609 Code | e3 | |
| Length | 13.97 mm | |
| Memory Density | 2304 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X9 | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC32,.5X.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 3.55 mm | |
| Standby Current-Max | 0.015 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 11.43 mm |
Alternate Parts for IDT7200L30JGB
This table gives cross-reference parts and alternative options found for IDT7200L30JGB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT7200L30JGB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C419-30JCT | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | IDT7200L30JGB vs CY7C419-30JCT |
| CY7C419-30JC | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | IDT7200L30JGB vs CY7C419-30JC |
| IDT7280L30JB | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Integrated Device Technology Inc | IDT7200L30JGB vs IDT7280L30JB |
| CY7C419-30JIT | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | IDT7200L30JGB vs CY7C419-30JIT |
| IDT7200L30JB | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Integrated Device Technology Inc | IDT7200L30JGB vs IDT7200L30JB |
| CY7C419-30JI | FIFO, 256X9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | IDT7200L30JGB vs CY7C419-30JI |