Part Details for IDT70V3389S6BFG8 by Integrated Device Technology Inc
Overview of IDT70V3389S6BFG8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for IDT70V3389S6BFG8
IDT70V3389S6BFG8 CAD Models
IDT70V3389S6BFG8 Part Data Attributes
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IDT70V3389S6BFG8
Integrated Device Technology Inc
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Datasheet
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IDT70V3389S6BFG8
Integrated Device Technology Inc
Application Specific SRAM, 64KX18, 6ns, CMOS, PBGA208
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Package Description | 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 6 ns | |
Clock Frequency-Max (fCLK) | 83 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B208 | |
JESD-609 Code | e1 | |
Memory Density | 1179648 bit | |
Memory IC Type | APPLICATION SPECIFIC SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Ports | 2 | |
Number of Terminals | 208 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA208,17X17,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.015 A | |
Standby Voltage-Min | 3.15 V | |
Supply Current-Max | 0.31 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |
Alternate Parts for IDT70V3389S6BFG8
This table gives cross-reference parts and alternative options found for IDT70V3389S6BFG8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70V3389S6BFG8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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IDT70V3389S6BFG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 64KX18, 6ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 | IDT70V3389S6BFG8 vs IDT70V3389S6BFG |
IDT70V3389S6BF | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 64KX18, 6ns, CMOS, PBGA208, FINE PITCH, BGA-208 | IDT70V3389S6BFG8 vs IDT70V3389S6BF |
70V3389S6BF | Renesas Electronics Corporation | Check for Price | 64K x 18 Sync, 3.3V Dual-Port RAM, Pipelined, Interleaved I/O''s, CABGA126/Tray | IDT70V3389S6BFG8 vs 70V3389S6BF |
70V3389S6BFG8 | Integrated Device Technology Inc | Check for Price | Application Specific SRAM, 64KX18, 6ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 | IDT70V3389S6BFG8 vs 70V3389S6BFG8 |
70V3389S6BF8 | Renesas Electronics Corporation | Check for Price | 64K x 18 Sync, 3.3V Dual-Port RAM, Pipelined, Interleaved I/O''s, CABGA0/Reel | IDT70V3389S6BFG8 vs 70V3389S6BF8 |