Datasheets
IDT70T3319S166BFG by: Integrated Device Technology Inc

Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208

Part Details for IDT70T3319S166BFG by Integrated Device Technology Inc

Overview of IDT70T3319S166BFG by Integrated Device Technology Inc

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Part Details for IDT70T3319S166BFG

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IDT70T3319S166BFG Part Data Attributes

IDT70T3319S166BFG Integrated Device Technology Inc
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IDT70T3319S166BFG Integrated Device Technology Inc Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LFBGA, BGA208,17X17,32
Pin Count 208
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.6 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code S-CBGA-B208
JESD-609 Code e1
Length 15 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm

Alternate Parts for IDT70T3319S166BFG

This table gives cross-reference parts and alternative options found for IDT70T3319S166BFG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70T3319S166BFG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
70V3319S166BFG8 Integrated Device Technology Inc Check for Price CABGA-208, Reel IDT70T3319S166BFG vs 70V3319S166BFG8
IDT70T3319S166BFGI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 12ns, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 IDT70T3319S166BFG vs IDT70T3319S166BFGI
70T3319S166BFG8 Integrated Device Technology Inc Check for Price CABGA-208, Reel IDT70T3319S166BFG vs 70T3319S166BFG8
70V3319S166BF Integrated Device Technology Inc $100.5636 CABGA-208, Tray IDT70T3319S166BFG vs 70V3319S166BF
70V3319S166BF Renesas Electronics Corporation Check for Price 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA126/Tray IDT70T3319S166BFG vs 70V3319S166BF
70T3319S166BF Integrated Device Technology Inc Check for Price CABGA-208, Tray IDT70T3319S166BFG vs 70T3319S166BF
70T3319S166BF8 Renesas Electronics Corporation Check for Price 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel IDT70T3319S166BFG vs 70T3319S166BF8
IDT70V3319S166BFG Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 IDT70T3319S166BFG vs IDT70V3319S166BFG
IDT70V3319S166BFGI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208 IDT70T3319S166BFG vs IDT70V3319S166BFGI
Part Number Manufacturer Composite Price Description Compare
IDT70T3319S166BFG8 Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FINE PITCH, BGA-208 IDT70T3319S166BFG vs IDT70T3319S166BFG8
70T3319S166BCGI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 IDT70T3319S166BFG vs 70T3319S166BCGI
IDT70T3319S166BCGI Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 IDT70T3319S166BFG vs IDT70T3319S166BCGI
70V3319S166BC8 Integrated Device Technology Inc Check for Price CABGA-256, Reel IDT70T3319S166BFG vs 70V3319S166BC8
70V3319S166PRFG8 Integrated Device Technology Inc Check for Price TQFP-128, Reel IDT70T3319S166BFG vs 70V3319S166PRFG8
IDT70V3319S166PRFG Integrated Device Technology Inc Check for Price Dual-Port SRAM, 256KX18, 3.6ns, CMOS, PQFP128, 14 X 20 MM X 1.4 MM, GREEN, PLASTIC, TQFP-128 IDT70T3319S166BFG vs IDT70V3319S166PRFG
70T3319S166BFG8 Renesas Electronics Corporation Check for Price 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel IDT70T3319S166BFG vs 70T3319S166BFG8
70V3319S166PRF Integrated Device Technology Inc Check for Price TQFP-128, Tray IDT70T3319S166BFG vs 70V3319S166PRF
70V3319S166PRFG Renesas Electronics Corporation Check for Price 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, TQFP72/Tray IDT70T3319S166BFG vs 70V3319S166PRFG
70T3319S166BC8 Renesas Electronics Corporation Check for Price 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel IDT70T3319S166BFG vs 70T3319S166BC8

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