Part Details for IDT6116SA55DGB by Integrated Device Technology Inc
Overview of IDT6116SA55DGB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Part Details for IDT6116SA55DGB
IDT6116SA55DGB CAD Models
IDT6116SA55DGB Part Data Attributes:
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IDT6116SA55DGB
Integrated Device Technology Inc
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Datasheet
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IDT6116SA55DGB
Integrated Device Technology Inc
Standard SRAM, 2KX8, 55ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, CERAMIC, DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e3 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 4.826 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for IDT6116SA55DGB
This table gives cross-reference parts and alternative options found for IDT6116SA55DGB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT6116SA55DGB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 8403611JA | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55DGB vs 8403611JA |
| 6116SA55DB | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55DGB vs 6116SA55DB |
| IDT6116LA55DB | Standard SRAM, 2KX8, 55ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | IDT6116SA55DGB vs IDT6116LA55DB |
| 8403610JA | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55DGB vs 8403610JA |
| 6116LA55DB | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55DGB vs 6116LA55DB |