Part Details for IDM29760JM/883 by Texas Instruments
Overview of IDM29760JM/883 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for IDM29760JM/883
IDM29760JM/883 CAD Models
IDM29760JM/883 Part Data Attributes
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IDM29760JM/883
Texas Instruments
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Datasheet
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IDM29760JM/883
Texas Instruments
256X4 OTPROM, 60ns, CDIP16, HERMETIC SEALED, DIP-16
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 60 ns | |
JESD-30 Code | R-GDIP-T16 | |
JESD-609 Code | e0 | |
Length | 19.43 mm | |
Memory Density | 1024 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256X4 | |
Output Characteristics | OPEN-COLLECTOR | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.13 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for IDM29760JM/883
This table gives cross-reference parts and alternative options found for IDM29760JM/883. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDM29760JM/883, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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IDM29761JM/883 | 256X4 OTPROM, 60ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | IDM29760JM/883 vs IDM29761JM/883 |
DM54S387J | 256X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | IDM29760JM/883 vs DM54S387J |
S82S129BEA | OTP ROM, 256X4, 60ns, Bipolar, CDIP16, 0.300 INCH, CERAMIC, DIP-16 | YAGEO Corporation | IDM29760JM/883 vs S82S129BEA |
IDM29760JM | IC 256 X 4 OTPROM, 60 ns, CDIP16, HERMETIC SEALED, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29760JM/883 vs IDM29760JM |
5962-8778801EA | OTP ROM, 256X4, 60ns, CMOS, CDIP16, CERAMIC, DIP-16 | Teledyne e2v | IDM29760JM/883 vs 5962-8778801EA |
IDM29760JM | 256X4 OTPROM, 60ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | IDM29760JM/883 vs IDM29760JM |
82S126/BEA | IC 256 X 4 OTPROM, 60 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | IDM29760JM/883 vs 82S126/BEA |
82S129/BEA | OTP ROM, 256X4, 60ns, Bipolar, CDIP16, | YAGEO Corporation | IDM29760JM/883 vs 82S129/BEA |
AM27S21/BEA | OTP ROM, 256X4, 60ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | IDM29760JM/883 vs AM27S21/BEA |
IDM29760JM/883 | IC 256 X 4 OTPROM, 60 ns, CDIP16, HERMETIC SEALED, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29760JM/883 vs IDM29760JM/883 |