There are no models available for this part yet.
Overview of IDM29750JM by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
CAD Models for IDM29750JM by National Semiconductor Corporation
Part Data Attributes for IDM29750JM by National Semiconductor Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
|
|
Package Description
|
DIP, DIP16,.3
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
40 ns
|
|
JESD-30 Code
|
R-GDIP-T16
|
|
JESD-609 Code
|
e0
|
|
Length
|
19.43 mm
|
|
Memory Density
|
256 bit
|
|
Memory IC Type
|
OTP ROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
16
|
|
Number of Words
|
32 words
|
|
Number of Words Code
|
32
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
32X8
|
|
Output Characteristics
|
OPEN-COLLECTOR
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP16,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.08 mm
|
|
Supply Current-Max
|
0.11 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
BIPOLAR
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
7.62 mm
|
Alternate Parts for IDM29750JM
This table gives cross-reference parts and alternative options found for IDM29750JM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDM29750JM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDM29750JM/883 | IC 32 X 8 OTPROM, 40 ns, CDIP16, HERMETIC SEALED, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29750JM vs IDM29750JM/883 |
| AM27S18DMB | OTP ROM, 32X8, 50ns, TTL, CDIP16, | AMD | IDM29750JM vs AM27S18DMB |
| TBP18SA030J | 32X8 OTPROM, 40ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | IDM29750JM vs TBP18SA030J |
| TBP18S030N | 32X8 OTPROM, 40ns, PDIP16, PLASTIC, DIP-16 | Texas Instruments | IDM29750JM vs TBP18S030N |
| IDM29750JM/883 | 32X8 OTPROM, 40ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | IDM29750JM vs IDM29750JM/883 |
| AM27S19PCB | OTP ROM, 32X8, 40ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | IDM29750JM vs AM27S19PCB |
| AM27S19DC | OTP ROM, 32X8, 40ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | IDM29750JM vs AM27S19DC |
| AM27S18PCB | OTP ROM, 32X8, 40ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | IDM29750JM vs AM27S18PCB |
| AM27S18PC | OTP ROM, 32X8, 40ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | IDM29750JM vs AM27S18PC |
| AM27S18DCTB | OTP ROM, 32X8, 40ns, TTL, CDIP16, | AMD | IDM29750JM vs AM27S18DCTB |