Part Details for IC61LV12816-12BI by Integrated Circuit Solution Inc
Overview of IC61LV12816-12BI by Integrated Circuit Solution Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 12-bit-2GSPS-Reference-Design | Renesas Electronics Corporation | 12-Bit, 2GSPS Reference Design using 4 Interleaved 12-Bit, 500MSPS ADCs | |
| ISL6612BIRZ-T | Renesas Electronics Corporation | Advanced Synchronous Rectified Buck MOSFET Drivers with Pre-POR OVP, DFN, /Reel | |
| ISL6612BIRZ | Renesas Electronics Corporation | Advanced Synchronous Rectified Buck MOSFET Drivers with Pre-POR OVP, DFN, /Tube |
Part Details for IC61LV12816-12BI
IC61LV12816-12BI CAD Models
IC61LV12816-12BI Part Data Attributes
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IC61LV12816-12BI
Integrated Circuit Solution Inc
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Datasheet
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IC61LV12816-12BI
Integrated Circuit Solution Inc
Standard SRAM, 128KX16, 12ns, CMOS, PBGA48,
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED CIRCUIT SOLUTION INC | |
| Package Description | FBGA, BGA48,6X8,30 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 12 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Number of Terminals | 48 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 3 V | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM |