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Microcontrollers and Processors / Microprocessors / IBM25EMPPC750LDBC3000
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IBM25EMPPC750LDBC3000 by: IBM

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

Part Details for IBM25EMPPC750LDBC3000 by IBM

Overview of IBM25EMPPC750LDBC3000 by IBM

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Part Details for IBM25EMPPC750LDBC3000

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IBM25EMPPC750LDBC3000 Part Data Attributes

Parametric Data
IBM25EMPPC750LDBC3000 IBM
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IBM25EMPPC750LDBC3000 IBM RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer IBM MICROELECTRONICS
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache NO
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for IBM25EMPPC750LDBC3000

This table gives cross-reference parts and alternative options found for IBM25EMPPC750LDBC3000. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IBM25EMPPC750LDBC3000, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IBM25EMPPC750LDBA3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LDBA3000
IBM25EMPPC750LEBB3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LEBB3000
IBM25EMPPC750LEBF3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LEBF3000
IBM25EMPPC750LFBF3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LFBF3000
IBM25EMPPC750LCBE3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LCBE3000
IBM25EMPPC750LDBF3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LDBF3000
IBM25EMPPC750LEBA3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LEBA3000
IBM25EMPPC750LCBF3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LCBF3000
IBM25EMPPC750LDBB3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LDBB3000
IBM25EMPPC750LCBC3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LCBC3000
Part Number Description Manufacturer Compare
XPC755BPX350LD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Freescale Semiconductor IBM25EMPPC750LDBC3000 vs XPC755BPX350LD
PC7400VGU350LX RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation IBM25EMPPC750LDBC3000 vs PC7400VGU350LX
PC7447VGU500NB RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v IBM25EMPPC750LDBC3000 vs PC7447VGU500NB
PPC7448HX667NC 32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor IBM25EMPPC750LDBC3000 vs PPC7448HX667NC
PCX7448MLH1000ND RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 Teledyne e2v IBM25EMPPC750LDBC3000 vs PCX7448MLH1000ND
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor IBM25EMPPC750LDBC3000 vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v IBM25EMPPC750LDBC3000 vs PCX7448VSH1267ND
IBM25EMPPC750LFBE3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM IBM25EMPPC750LDBC3000 vs IBM25EMPPC750LFBE3000
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group IBM25EMPPC750LDBC3000 vs TSPC750AVGB/Q12LE
TSXPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation IBM25EMPPC750LDBC3000 vs TSXPC750AMGSB/T12LE

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