There are no models available for this part yet.
Overview of HYI18T1G160C2F-3S by Qimonda AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for HYI18T1G160C2F-3S by Qimonda AG
Part Data Attributes for HYI18T1G160C2F-3S by Qimonda AG
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|
|
|---|---|
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Rohs Code
|
Yes
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|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
QIMONDA AG
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Part Package Code
|
BGA
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Package Description
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TFBGA, BGA84,9X15,32
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Pin Count
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84
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Reach Compliance Code
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unknown
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.32
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Access Mode
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MULTI BANK PAGE BURST
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Access Time-Max
|
0.45 ns
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Additional Feature
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AUTO/SELF REFRESH
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Clock Frequency-Max (fCLK)
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333 MHz
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I/O Type
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COMMON
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Interleaved Burst Length
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4,8
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JESD-30 Code
|
R-PBGA-B84
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Length
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12.5 mm
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Memory Density
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1073741824 bit
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Memory IC Type
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DDR2 DRAM
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Memory Width
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16
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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84
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Number of Words
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67108864 words
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Number of Words Code
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64000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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64MX16
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TFBGA
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Package Equivalence Code
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BGA84,9X15,32
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Qualification Status
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Not Qualified
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Refresh Cycles
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8192
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Seated Height-Max
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1.2 mm
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Self Refresh
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YES
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Sequential Burst Length
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4,8
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Standby Current-Max
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0.013 A
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Supply Current-Max
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0.306 mA
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Supply Voltage-Max (Vsup)
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1.9 V
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Supply Voltage-Min (Vsup)
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1.7 V
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Supply Voltage-Nom (Vsup)
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1.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Width
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8 mm
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Alternate Parts for HYI18T1G160C2F-3S
This table gives cross-reference parts and alternative options found for HYI18T1G160C2F-3S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYI18T1G160C2F-3S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HYB18T1G160C2C-3S | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, PLASTIC, TFBGA-84 | Qimonda AG | HYI18T1G160C2F-3S vs HYB18T1G160C2C-3S |
| HYB18T1G160C2C-3 | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, PLASTIC, TFBGA-84 | Qimonda AG | HYI18T1G160C2F-3S vs HYB18T1G160C2C-3 |
| HYI18T1G160C2C-3S | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, PLASTIC, TFBGA-84 | Qimonda AG | HYI18T1G160C2F-3S vs HYI18T1G160C2C-3S |
| M14D1G1664A-3BG2D | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-84 | Elite Semiconductor Memory Technology Inc | HYI18T1G160C2F-3S vs M14D1G1664A-3BG2D |