Part Details for HYI0UGG0MF1-6SS0E by SK Hynix Inc
Overview of HYI0UGG0MF1-6SS0E by SK Hynix Inc
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Telecommunications
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Computing and Data Storage
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for HYI0UGG0MF1-6SS0E
HYI0UGG0MF1-6SS0E CAD Models
HYI0UGG0MF1-6SS0E Part Data Attributes:
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HYI0UGG0MF1-6SS0E
SK Hynix Inc
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Datasheet
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HYI0UGG0MF1-6SS0E
SK Hynix Inc
Memory Circuit,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | NAND FLASH IS ORGANISED AS 128M X 8 | |
| JESD-30 Code | R-PBGA-B149 | |
| Length | 14 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 149 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |