Part Details for HYB18T1G400C2F-25F by Qimonda AG
Overview of HYB18T1G400C2F-25F by Qimonda AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HYB18T1G400C2F-25F
HYB18T1G400C2F-25F CAD Models
HYB18T1G400C2F-25F Part Data Attributes
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HYB18T1G400C2F-25F
Qimonda AG
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Datasheet
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HYB18T1G400C2F-25F
Qimonda AG
DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QIMONDA AG | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA60,9X11,32 | |
| Pin Count | 60 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 12.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA60,9X11,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Supply Current-Max | 0.251 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
Alternate Parts for HYB18T1G400C2F-25F
This table gives cross-reference parts and alternative options found for HYB18T1G400C2F-25F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB18T1G400C2F-25F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HYI18T1G400C2C-25F | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYI18T1G400C2C-25F |
| HYI18T1G400C2F-2.5 | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYI18T1G400C2F-2.5 |
| HYB18T1G400C2C-25F | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYB18T1G400C2C-25F |
| HYB18T1G400C2F-2.5 | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYB18T1G400C2F-2.5 |
| HYB18T1G400C4F-25F | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYB18T1G400C4F-25F |
| HYB18T1G400C2C-2.5 | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYB18T1G400C2C-2.5 |
| HYB18T1G400C2FL-2.5 | DDR DRAM, 256MX4, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | HYB18T1G400C2F-25F vs HYB18T1G400C2FL-2.5 |