There are no models available for this part yet.
Overview of HY5PG1G831CLFP-Y5 by SK Hynix Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for HY5PG1G831CLFP-Y5 by SK Hynix Inc
Part Data Attributes for HY5PG1G831CLFP-Y5 by SK Hynix Inc
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SK HYNIX INC
|
Part Package Code
|
BGA
|
Package Description
|
TFBGA, BGA60,9X11,32
|
Pin Count
|
60
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.32
|
Access Mode
|
MULTI BANK PAGE BURST
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK)
|
333 MHz
|
I/O Type
|
COMMON
|
Interleaved Burst Length
|
4,8
|
JESD-30 Code
|
R-XZMA-N203
|
JESD-609 Code
|
e1
|
Length
|
11.4 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
DDR2 DRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
60
|
Number of Words
|
134217728 words
|
Number of Words Code
|
128000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
128MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TFBGA
|
Package Equivalence Code
|
BGA60,9X11,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Refresh Cycles
|
8192
|
Seated Height-Max
|
1.2 mm
|
Self Refresh
|
YES
|
Sequential Burst Length
|
4,8
|
Supply Current-Max
|
0.17 mA
|
Supply Voltage-Max (Vsup)
|
1.6 V
|
Supply Voltage-Min (Vsup)
|
1.5 V
|
Supply Voltage-Nom (Vsup)
|
1.55 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
ZIG-ZAG
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
Width
|
8 mm
|
Alternate Parts for HY5PG1G831CLFP-Y5
This table gives cross-reference parts and alternative options found for HY5PG1G831CLFP-Y5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5PG1G831CLFP-Y5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MT47H128M8HQ-37EAT | 128MX8 DDR DRAM, 0.45ns, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | HY5PG1G831CLFP-Y5 vs MT47H128M8HQ-37EAT |
MT47H128M8HQ-3ELAT:G | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | HY5PG1G831CLFP-Y5 vs MT47H128M8HQ-3ELAT:G |
HYB15T1G800C2F-3.7 | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, PLASTIC, TFBGA-60 | Qimonda AG | HY5PG1G831CLFP-Y5 vs HYB15T1G800C2F-3.7 |
MT47J128M8HQ-37E:E | DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | HY5PG1G831CLFP-Y5 vs MT47J128M8HQ-37E:E |
MT47H128M8HQ-25ELIT:G | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | HY5PG1G831CLFP-Y5 vs MT47H128M8HQ-25ELIT:G |
W971GG8JB-25 | DDR DRAM, 16MX8, 0.4ns, CMOS, PBGA60, WBGA-60 | Winbond Electronics Corp | HY5PG1G831CLFP-Y5 vs W971GG8JB-25 |
MT47H128M8HV-5EL:G | DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | HY5PG1G831CLFP-Y5 vs MT47H128M8HV-5EL:G |
HYB18T1G800CF-5 | DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | HY5PG1G831CLFP-Y5 vs HYB18T1G800CF-5 |
HYI18T1G800C2C-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, PLASTIC, TFBGA-60 | Qimonda AG | HY5PG1G831CLFP-Y5 vs HYI18T1G800C2C-3S |
H5PS1G83EFR-C4Q | DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 | SK Hynix Inc | HY5PG1G831CLFP-Y5 vs H5PS1G83EFR-C4Q |