Datasheets
HY5DU56822L-K by: SK Hynix Inc

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

Part Details for HY5DU56822L-K by SK Hynix Inc

Overview of HY5DU56822L-K by SK Hynix Inc

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Applications Consumer Electronics Computing and Data Storage

Part Details for HY5DU56822L-K

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HY5DU56822L-K Part Data Attributes

HY5DU56822L-K SK Hynix Inc
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HY5DU56822L-K SK Hynix Inc DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 66
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G66
JESD-609 Code e6
Length 22.225 mm
Memory Density 268435456 bit
Memory IC Type DDR DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 66
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for HY5DU56822L-K

This table gives cross-reference parts and alternative options found for HY5DU56822L-K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5DU56822L-K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYB25D256800CEL-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, PLASTIC, TSOP2-66 Infineon Technologies AG HY5DU56822L-K vs HYB25D256800CEL-7
EDD2508AJTA-7A DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, PLASTIC, TSOP2-66 Elpida Memory Inc HY5DU56822L-K vs EDD2508AJTA-7A
V58C2256804SAT75 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, TSOP2-66 Mosel Vitelic Corporation HY5DU56822L-K vs V58C2256804SAT75
HYB25D256800E-7.5 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 Infineon Technologies AG HY5DU56822L-K vs HYB25D256800E-7.5
MT46V32M8P-75ITH 32MX8 DDR DRAM, 0.75ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8P-75ITH
V58C2256804SCI7I DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc HY5DU56822L-K vs V58C2256804SCI7I
MT46V32M8TC-6T:G DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8TC-6T:G
TC59LM806CTG-55 IC 32M X 8 DDR DRAM, 0.75 ns, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSOP2-66, Dynamic RAM Toshiba America Electronic Components HY5DU56822L-K vs TC59LM806CTG-55
MT46V32M8P-75ELITH 32MX8 DDR DRAM, 0.75ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8P-75ELITH
V58C2256804SXT75 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, TSOP2-66 Mosel Vitelic Corporation HY5DU56822L-K vs V58C2256804SXT75
Part Number Description Manufacturer Compare
MT46V32M8P-75ZIT DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8P-75ZIT
MT46V32M8TC-5B:G DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8TC-5B:G
IBMN625805GT3B-75N DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 IBM HY5DU56822L-K vs IBMN625805GT3B-75N
M2S56D30ATP-75AL DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Elpida Memory Inc HY5DU56822L-K vs M2S56D30ATP-75AL
IS43R83200B-75TLI DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66 Integrated Silicon Solution Inc HY5DU56822L-K vs IS43R83200B-75TLI
MT46V32M8TC-5B:C DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822L-K vs MT46V32M8TC-5B:C
VG37256802AT-66 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Vanguard International Semiconductor Corporation HY5DU56822L-K vs VG37256802AT-66
MT46V32M8FG-75ZLIT:C DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 8 X 14 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822L-K vs MT46V32M8FG-75ZLIT:C
K4H560838F-TCAA0 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor HY5DU56822L-K vs K4H560838F-TCAA0
NT5DS32M8AT-66 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 Nanya Technology Corporation HY5DU56822L-K vs NT5DS32M8AT-66

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