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Overview of HTSMOH5601EV,118 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for HTSMOH5601EV,118 by NXP Semiconductors
Part Data Attributes for HTSMOH5601EV,118 by NXP Semiconductors
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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NXP SEMICONDUCTORS
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Part Package Code
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COB
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Package Description
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DIE,
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Pin Count
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35
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Manufacturer Package Code
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SOT500-1
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Reach Compliance Code
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unknown
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HTS Code
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8542.32.00.71
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JESD-30 Code
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X-XUUC-N
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JESD-609 Code
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e4
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Number of Functions
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1
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-25 °C
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Package Body Material
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UNSPECIFIED
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Package Code
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DIE
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Package Shape
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UNSPECIFIED
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Package Style
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UNCASED CHIP
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Qualification Status
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Not Qualified
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Surface Mount
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YES
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Telecom IC Type
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TELECOM CIRCUIT
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Temperature Grade
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OTHER
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Terminal Finish
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Silver (Ag)
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Terminal Form
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NO LEAD
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Terminal Position
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UPPER
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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