Datasheets
HS9474T/B-1 by:

ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28

Part Details for HS9474T/B-1 by Spectrum Microwave

Overview of HS9474T/B-1 by Spectrum Microwave

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for HS9474T/B-1

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HS9474T/B-1 Part Data Attributes

HS9474T/B-1 Spectrum Microwave
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HS9474T/B-1 Spectrum Microwave ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28
Part Life Cycle Code Transferred
Ihs Manufacturer SATCON ELECTRONICS
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Analog Input Voltage-Max 16.5 V
Analog Input Voltage-Min -16.5 V
Conversion Time-Max 25 µs
Converter Type ADC SUBSYSTEM
JESD-30 Code R-CDIP-T28
Linearity Error-Max (EL) 0.012%
Negative Supply Voltage-Nom -15 V
Number of Analog In Channels 1
Number of Bits 12
Number of Functions 1
Number of Terminals 28
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Bit Code BINARY, OFFSET BINARY
Output Format PARALLEL, WORD
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
Sample Rate 0.056 MHz
Sample and Hold / Track and Hold SAMPLE
Supply Voltage-Nom 15 V
Surface Mount NO
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HS9474T/B-1

This table gives cross-reference parts and alternative options found for HS9474T/B-1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HS9474T/B-1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HS9474J-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474J-2
HS9474J-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474J-1
HS9474J-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474J-2
HS9474S/B-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Microwave HS9474T/B-1 vs HS9474S/B-2
HS9474K-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474K-2
HS9474S/B-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474S/B-1
HS9474K-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Microwave HS9474T/B-1 vs HS9474K-1
HS9474T/B-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474T/B-1
HS9474T/B-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474T/B-1
HS9474K-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474K-2
Part Number Description Manufacturer Compare
HS9474T/B-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Microwave HS9474T/B-1 vs HS9474T/B-2
HS9474K-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474K-1
HS9474T/B-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474T/B-2
HS9474K-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474K-2
HS9474K-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Microwave HS9474T/B-1 vs HS9474K-1
HS9474J-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474J-1
HS9474T/B-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474T/B-2
HS9474T/B-1 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 API Technologies Corp EIS (RETIRED) HS9474T/B-1 vs HS9474T/B-1
HS9474K-2 ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474K-2
HS9474J-1 ADC Subsystem, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 Spectrum Control HS9474T/B-1 vs HS9474J-1

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