Datasheets
HN62W454P-12 by: Hitachi Ltd

MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40

Part Details for HN62W454P-12 by Hitachi Ltd

Overview of HN62W454P-12 by Hitachi Ltd

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Applications Consumer Electronics Security and Surveillance

Part Details for HN62W454P-12

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HN62W454P-12 Part Data Attributes

HN62W454P-12 Hitachi Ltd
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HN62W454P-12 Hitachi Ltd MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description DIP, DIP40,.6
Pin Count 40
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
Additional Feature USER CONFIGURABLE AS 256K X 16
Alternate Memory Width 8
JESD-30 Code R-PDIP-T40
JESD-609 Code e0
Length 52.8 mm
Memory Density 4194304 bit
Memory IC Type MASK ROM
Memory Width 16
Number of Functions 1
Number of Terminals 40
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00003 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN62W454P-12

This table gives cross-reference parts and alternative options found for HN62W454P-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN62W454P-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY23V04200D-120 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 SK Hynix Inc HN62W454P-12 vs HY23V04200D-120
MX23L4100PC-12 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Macronix International Co Ltd HN62W454P-12 vs MX23L4100PC-12
K3N3U1000D-DC12 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor HN62W454P-12 vs K3N3U1000D-DC12
HN62W454BP-12 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Hitachi Ltd HN62W454P-12 vs HN62W454BP-12
HY23W04200D MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 SK Hynix Inc HN62W454P-12 vs HY23W04200D
Part Number Description Manufacturer Compare
MSM534020CRS MASK ROM, 256KX16, 100ns, CMOS, PDIP40, PLASTIC, DIP-40 OKI Electric Industry Co Ltd HN62W454P-12 vs MSM534020CRS
LH53B4P00D MASK ROM, 512KX8, 120ns, CMOS, PDIP40, DIP-40 Sharp Corp HN62W454P-12 vs LH53B4P00D
LH534096D MASK ROM, 256KX16, 100ns, CMOS, PDIP40, DIP-40 Sharp Corp HN62W454P-12 vs LH534096D
KM23V4100D MASK ROM, 512KX8, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor HN62W454P-12 vs KM23V4100D
MSM534000CRS MASK ROM, 256KX16, 120ns, CMOS, PDIP40, PLASTIC, DIP-40 OKI Electric Industry Co Ltd HN62W454P-12 vs MSM534000CRS
HN62454BP-85 MASK ROM, 256KX16, 85ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Hitachi Ltd HN62W454P-12 vs HN62454BP-85
KM23C4200D-12 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor HN62W454P-12 vs KM23C4200D-12
K3N3V1000D-DC10 MASK ROM, 256KX16, 100ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor HN62W454P-12 vs K3N3V1000D-DC10
K3N3C1000D-DC080 MASK ROM, 256KX16, 80ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor HN62W454P-12 vs K3N3C1000D-DC080
GM23C4100-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP40, Goldstar Electron Co Ltd HN62W454P-12 vs GM23C4100-15

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