Datasheets
HN27C101G-20 by:

UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32

Part Details for HN27C101G-20 by Hitachi Ltd

Overview of HN27C101G-20 by Hitachi Ltd

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for HN27C101G-20

Part # Distributor Description Stock Price Buy
Quest Components 27C101G-20 18
  • 1 $9.0000
  • 4 $6.6000
  • 12 $6.0000
$6.0000 / $9.0000 Buy Now
Quest Components 27C101G-20 8
  • 1 $9.0000
  • 2 $7.5000
  • 4 $6.6000
$6.6000 / $9.0000 Buy Now

Part Details for HN27C101G-20

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HN27C101G-20 Part Data Attributes

HN27C101G-20 Hitachi Ltd
Buy Now Datasheet
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HN27C101G-20 Hitachi Ltd UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description WDIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T32
Length 41.91 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.8 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C101G-20

This table gives cross-reference parts and alternative options found for HN27C101G-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C101G-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TMS27C010A-20JL 1 048 576-Bit Programmable Read-Only Memory 32-CDIP 0 to 70 Texas Instruments HN27C101G-20 vs TMS27C010A-20JL
NMC27C010Q20 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 Texas Instruments HN27C101G-20 vs NMC27C010Q20
SMJ27C010A-20J 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 Texas Instruments HN27C101G-20 vs SMJ27C010A-20J
HN27C301G-20 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd HN27C101G-20 vs HN27C301G-20
AM27C010-200DCB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion HN27C101G-20 vs AM27C010-200DCB
NM27C010QE200 128KX8 UVPROM, 200ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments HN27C101G-20 vs NM27C010QE200
AT27LV010-20DI UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation HN27C101G-20 vs AT27LV010-20DI
DPV27C101-200C UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 Twilight Technology Inc HN27C101G-20 vs DPV27C101-200C
5962-8961403QXX UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components HN27C101G-20 vs 5962-8961403QXX
M5M27C100K-2 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, GLASS SEALED, CERDIP-32 Mitsubishi Electric HN27C101G-20 vs M5M27C100K-2
Part Number Description Manufacturer Compare
WME128K8-150CMEA EEPROM, 128KX8, 150ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C101G-20 vs WME128K8-150CMEA
28C010TRT1DS-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN27C101G-20 vs 28C010TRT1DS-12
CAT28F010PI-12 Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101G-20 vs CAT28F010PI-12
CAT28F001LA-12T Flash, 128KX8, 120ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101G-20 vs CAT28F001LA-12T
5962-8961401MXA UVPROM, 128KX8, 300ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor HN27C101G-20 vs 5962-8961401MXA
5962-9669005HYX Flash, 128KX8, 60ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C101G-20 vs 5962-9669005HYX
CAT28F010L-12 Flash, 128KX8, 120ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101G-20 vs CAT28F010L-12
5962-8961405MXX UVPROM, 128KX8, 150ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor HN27C101G-20 vs 5962-8961405MXX
CAT28F010PA-70 Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101G-20 vs CAT28F010PA-70
CAT28F001P-70T Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101G-20 vs CAT28F001P-70T

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