Part Details for HN27256P-25 by Hitachi Ltd
Overview of HN27256P-25 by Hitachi Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for HN27256P-25
HN27256P-25 CAD Models
HN27256P-25 Part Data Attributes
|
HN27256P-25
Hitachi Ltd
Buy Now
Datasheet
|
Compare Parts:
HN27256P-25
Hitachi Ltd
OTP ROM, 32KX8, 250ns, NMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | HITACHI LTD | |
Part Package Code | DIP | |
Package Description | DIP, DIP28,.6 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 250 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDIP-T28 | |
JESD-609 Code | e0 | |
Length | 35.6 mm | |
Memory Density | 262144 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.7 mm | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for HN27256P-25
This table gives cross-reference parts and alternative options found for HN27256P-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27256P-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
QP27256-25 | OTP ROM, 32KX8, 250ns, NMOS, PDIP28, PLASTIC, DIP-28 | Intel Corporation | HN27256P-25 vs QP27256-25 |
TMS27PC256-25NL4 | 32KX8 OTPROM, 250ns, PDIP28 | Texas Instruments | HN27256P-25 vs TMS27PC256-25NL4 |
NMC27C256BN25 | IC 32K X 8 OTPROM, 250 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | National Semiconductor Corporation | HN27256P-25 vs NMC27C256BN25 |
TMS27PC256-25NE4 | 32KX8 OTPROM, 250ns, PDIP28 | Texas Instruments | HN27256P-25 vs TMS27PC256-25NE4 |
NMC27C256BN250 | IC 32K X 8 OTPROM, 250 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Texas Instruments | HN27256P-25 vs NMC27C256BN250 |
NMC27C256BN250 | IC 32K X 8 OTPROM, 250 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | National Semiconductor Corporation | HN27256P-25 vs NMC27C256BN250 |
AM27256PC | OTP ROM, 32KX8, 250ns, NMOS, PDIP28, PLASTIC, DIP-28 | AMD | HN27256P-25 vs AM27256PC |
AM27C256-255PI | OTP ROM, 32KX8, 250ns, CMOS, PDIP28, DIP-28 | Spansion | HN27256P-25 vs AM27C256-255PI |
AM27C256-250PC | OTP ROM, 32KX8, 250ns, CMOS, PDIP28, PLASTIC, DIP-28 | AMD | HN27256P-25 vs AM27C256-250PC |
NM27LC256NE250 | 32KX8 OTPROM, 250ns, PDIP28, PLASTIC, DIP-28 | Texas Instruments | HN27256P-25 vs NM27LC256NE250 |