Part Details for HM67B3632-9 by Renesas Electronics Corporation
Overview of HM67B3632-9 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for HM67B3632-9
HM67B3632-9 CAD Models
HM67B3632-9 Part Data Attributes
|
|
HM67B3632-9
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
HM67B3632-9
Renesas Electronics Corporation
32KX36 CACHE SRAM, 9ns, PQFP100, QFP-100
|
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | RENESAS TECHNOLOGY CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 9 ns | |
| Additional Feature | BURST COUNTER; SELF TIMED WRITE CYCLE; ADDRESS/DATA REGISTER | |
| JESD-30 Code | R-PQFP-G100 | |
| Length | 20 mm | |
| Memory Density | 1179648 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.05 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for HM67B3632-9
This table gives cross-reference parts and alternative options found for HM67B3632-9. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM67B3632-9, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MCM69F536CTQ10R | 32KX36 CACHE SRAM, 10ns, PQFP100, TQFP-100 | Motorola Mobility LLC | HM67B3632-9 vs MCM69F536CTQ10R |
| MCM69F536BTQ9 | 32KX36 CACHE SRAM, 9ns, PQFP100, TQFP-100 | Motorola Mobility LLC | HM67B3632-9 vs MCM69F536BTQ9 |
| PDM44056S6TQ | Cache SRAM, 32KX36, CMOS, PQFP100 | Paradigm Technology Inc | HM67B3632-9 vs PDM44056S6TQ |
| MT58LC32K36F1LG-11TR | Cache SRAM, 32KX36, 6ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Micron Technology Inc | HM67B3632-9 vs MT58LC32K36F1LG-11TR |
| IBM043614PQK-10 | Standard SRAM, 32KX36, 10ns, CMOS, PQFP100, TQFP-100 | IBM | HM67B3632-9 vs IBM043614PQK-10 |
| MT58LC32K36B2LG-12 | Standard SRAM, 32KX36, 12ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Micron Technology Inc | HM67B3632-9 vs MT58LC32K36B2LG-12 |
| MT58LC32K36D7LG-8 | Standard SRAM, 32KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Micron Technology Inc | HM67B3632-9 vs MT58LC32K36D7LG-8 |
| MT58LC32K36P3LG-10 | Standard SRAM, 128KX9, 10ns, CMOS, PQFP100, TQFP-100 | Micron Technology Inc | HM67B3632-9 vs MT58LC32K36P3LG-10 |
| MT58LC32K36C5LG-9 | Standard SRAM, 32KX36, 9ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Micron Technology Inc | HM67B3632-9 vs MT58LC32K36C5LG-9 |
| MCM69F536TQ10 | 32KX36 CACHE SRAM, 10ns, PQFP100, TQFP-100 | Motorola Mobility LLC | HM67B3632-9 vs MCM69F536TQ10 |