Part Details for HM62W8201HJP-15 by Renesas Electronics Corporation
Overview of HM62W8201HJP-15 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Computing and Data Storage
Financial Technology (Fintech)
Aerospace and Defense
Part Details for HM62W8201HJP-15
HM62W8201HJP-15 CAD Models
HM62W8201HJP-15 Part Data Attributes
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HM62W8201HJP-15
Renesas Electronics Corporation
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Datasheet
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HM62W8201HJP-15
Renesas Electronics Corporation
2MX8 CACHE SRAM, 15ns, PDSO36, 0.400 INCH, PLASTIC, SOJ-36
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | RENESAS TECHNOLOGY CORP | |
| Part Package Code | SOJ | |
| Package Description | SOJ, | |
| Pin Count | 36 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 15 ns | |
| JESD-30 Code | R-PDSO-J36 | |
| Length | 23.25 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 36 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOJ | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.76 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 10.16 mm |
Alternate Parts for HM62W8201HJP-15
This table gives cross-reference parts and alternative options found for HM62W8201HJP-15. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM62W8201HJP-15, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WMS512K8-100DJI | Standard SRAM, 512KX8, 100ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs WMS512K8-100DJI |
| EDI88512LPA-25MBG | Standard SRAM, 512KX8, 25ns, CMOS, PDSO36, ROHS COMPLIANT, PLASTIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs EDI88512LPA-25MBG |
| 5962-9561321HZC | Standard SRAM, 512KX8, 35ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs 5962-9561321HZC |
| WMS512K8L-20DJMA | Standard SRAM, 512KX8, 20ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs WMS512K8L-20DJMA |
| WMS512K8-85DJI | Standard SRAM, 512KX8, 85ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs WMS512K8-85DJI |
| 5962-9561323HZC | Standard SRAM, 512KX8, 20ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs 5962-9561323HZC |
| WMS512K8L-45DJIA | Standard SRAM, 512KX8, 45ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs WMS512K8L-45DJIA |
| 5962-9561319HZA | Standard SRAM, 512KX8, 55ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs 5962-9561319HZA |
| PDM31096SA20SOI | Standard SRAM, 512KX8, 20ns, CMOS, PDSO36 | Paradigm Technology Inc | HM62W8201HJP-15 vs PDM31096SA20SOI |
| WMS512K8-17DJQ | Standard SRAM, 512KX8, 17ns, CMOS, CDSO36, CERAMIC, SOJ-36 | Microsemi Corporation | HM62W8201HJP-15 vs WMS512K8-17DJQ |