Part Details for HFA1113IBZ96 by Intersil Corporation
Overview of HFA1113IBZ96 by Intersil Corporation
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Part Details for HFA1113IBZ96
HFA1113IBZ96 CAD Models
HFA1113IBZ96 Part Data Attributes
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HFA1113IBZ96
Intersil Corporation
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Datasheet
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HFA1113IBZ96
Intersil Corporation
850MHz, Low Distortion, Output Limiting, Programmable Gain, Buffer Amplifier; SOIC8; Temp Range: -40° to 85°C
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTERSIL CORP | |
Part Package Code | SOIC | |
Package Description | SOP, SOP8,.25 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Amplifier Type | BUFFER | |
Average Bias Current-Max (IIB) | 65 µA | |
Bandwidth (3dB)-Nom | 850 MHz | |
Bias Current-Max (IIB) @25C | 40 µA | |
Input Offset Voltage-Max | 35000 µV | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 3 | |
Neg Supply Voltage Limit-Max | -6 V | |
Neg Supply Voltage-Nom (Vsup) | -5 V | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Min | 0.05 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.75 mm | |
Slew Rate-Min | 800 V/us | |
Slew Rate-Nom | 2400 V/us | |
Supply Current-Max | 33 mA | |
Supply Voltage Limit-Max | 6 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm |