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Overview of HEF4002BPN by Philips Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Industrial Automation
Financial Technology (Fintech)
Healthcare
Electronic Manufacturing
CAD Models for HEF4002BPN by Philips Semiconductors
Part Data Attributes for HEF4002BPN by Philips Semiconductors
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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PHILIPS SEMICONDUCTORS
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Package Description
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DIP, DIP14,.3
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Reach Compliance Code
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unknown
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HTS Code
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8542.39.00.01
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JESD-30 Code
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R-PDIP-T14
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JESD-609 Code
|
e4
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Load Capacitance (CL)
|
50 pF
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Logic IC Type
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NOR GATE
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Max I(ol)
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0.00035999999999999997 A
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Number of Terminals
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14
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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DIP
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Package Equivalence Code
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DIP14,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Prop. Delay@Nom-Sup
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120 ns
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Qualification Status
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Not Qualified
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Schmitt Trigger
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NO
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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Nickel/Palladium/Gold (Ni/Pd/Au)
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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