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Overview of HD6473214F16V by Renesas Electronics Corporation
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
CAD Models for HD6473214F16V by Renesas Electronics Corporation
Part Data Attributes for HD6473214F16V by Renesas Electronics Corporation
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
|
Part Package Code
|
QFP
|
Package Description
|
QFP,
|
Pin Count
|
64
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Has ADC
|
NO
|
Address Bus Width
|
16
|
Bit Size
|
8
|
Boundary Scan
|
NO
|
Clock Frequency-Max
|
16 MHz
|
DAC Channels
|
NO
|
DMA Channels
|
NO
|
External Data Bus Width
|
8
|
JESD-30 Code
|
S-PQFP-G64
|
JESD-609 Code
|
e6
|
Length
|
14 mm
|
Moisture Sensitivity Level
|
3
|
Number of I/O Lines
|
53
|
Number of Terminals
|
64
|
On Chip Program ROM Width
|
8
|
Operating Temperature-Max
|
75 °C
|
Operating Temperature-Min
|
-20 °C
|
PWM Channels
|
YES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
ROM (words)
|
32768
|
ROM Programmability
|
OTPROM
|
Seated Height-Max
|
3.05 mm
|
Speed
|
16 MHz
|
Supply Voltage-Max
|
5.5 V
|
Supply Voltage-Min
|
4.5 V
|
Supply Voltage-Nom
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL EXTENDED
|
Terminal Finish
|
Tin/Bismuth (Sn/Bi)
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
Width
|
14 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|