Part Details for HD64336912GXXXTP by Renesas Electronics Corporation
Overview of HD64336912GXXXTP by Renesas Electronics Corporation
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Part Details for HD64336912GXXXTP
HD64336912GXXXTP CAD Models
HD64336912GXXXTP Part Data Attributes
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HD64336912GXXXTP
Renesas Electronics Corporation
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HD64336912GXXXTP
Renesas Electronics Corporation
16-BIT, MROM, 12MHz, MICROCONTROLLER, PDSO32, 11.3 X 20.45 MM, 1.27 MM PITCH, SOP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | SOIC | |
Package Description | 11.3 X 20.45 MM, 1.27 MM PITCH, SOP-32 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
CPU Family | H8/300H | |
Clock Frequency-Max | 10.4 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G32 | |
Length | 20.45 mm | |
Moisture Sensitivity Level | 1 | |
Number of I/O Lines | 22 | |
Number of Terminals | 32 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP32,.56 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Qualification Status | Not Qualified | |
RAM (bytes) | 512 | |
ROM (words) | 8192 | |
ROM Programmability | MROM | |
Seated Height-Max | 3 mm | |
Speed | 12 MHz | |
Supply Current-Max | 18 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 11.3 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |