Datasheets
H5DU5162EFR-E3I by: SK Hynix Inc

DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60

Part Details for H5DU5162EFR-E3I by SK Hynix Inc

Overview of H5DU5162EFR-E3I by SK Hynix Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Entertainment and Gaming

Part Details for H5DU5162EFR-E3I

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H5DU5162EFR-E3I Part Data Attributes:

H5DU5162EFR-E3I SK Hynix Inc
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H5DU5162EFR-E3I SK Hynix Inc DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description VBGA, BGA60,9X12,40/32
Pin Count 60
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60
JESD-609 Code e1
Length 12 mm
Memory Density 536870912 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VBGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.26 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 8 mm

Alternate Parts for H5DU5162EFR-E3I

This table gives cross-reference parts and alternative options found for H5DU5162EFR-E3I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5DU5162EFR-E3I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT46V32M16FN-5BIT DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-5BIT
MT46V32M16BN-5BLIT DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16BN-5BLIT
MT46V32M16BN-5BLIT:C DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16BN-5BLIT:C
MT46V32M16FN-5BLIT DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-5BLIT
MT46V32M16FN-5BLIT:C DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-5BLIT:C
MT46V32M16FN-5BIT:C DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-5BIT:C
H5DU5162EFR-E3J DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc H5DU5162EFR-E3I vs H5DU5162EFR-E3J
Part Number Description Manufacturer Compare
MT46V32M16FN-75L DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-75L
NT5DS32M16AF-75B DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, BGA-60 Nanya Technology Corporation H5DU5162EFR-E3I vs NT5DS32M16AF-75B
TC59LM914AMB-50 IC 32M X 16 DDR DRAM, 24 ns, PBGA60, 13 X 17 MM, 1 MM PITCH, PLASTIC, BGA-60, Dynamic RAM Toshiba America Electronic Components H5DU5162EFR-E3I vs TC59LM914AMB-50
V58C2512164SDLJ4 DDR DRAM, 32MX16, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc H5DU5162EFR-E3I vs V58C2512164SDLJ4
MT46V32M16FN-75 DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT46V32M16FN-75
V58C2512164SALS6I DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, MO-207, FBGA-60 ProMOS Technologies Inc H5DU5162EFR-E3I vs V58C2512164SALS6I
H5DU5162EFR-K2J DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc H5DU5162EFR-E3I vs H5DU5162EFR-K2J
K4H511638C-ZIB30 DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 Samsung Semiconductor H5DU5162EFR-E3I vs K4H511638C-ZIB30
IS43LR16320B-6BLI DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 8 X 10 MM, LEAD FREE, MO-207, TFBGA-60 Integrated Silicon Solution Inc H5DU5162EFR-E3I vs IS43LR16320B-6BLI
MT47H32M16B6-37EL:D DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA60, 10 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc H5DU5162EFR-E3I vs MT47H32M16B6-37EL:D

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