There are no models available for this part yet.
Overview of GS881Z32BGD-300T by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 6 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Security and Surveillance
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 2SA1330(0)-T1B-A | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SA1330(0)-T1B-AT | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SB1300-T-AZ | Renesas Electronics Corporation | Bipolar Power Transistors |
CAD Models for GS881Z32BGD-300T by GSI Technology
Part Data Attributes for GS881Z32BGD-300T by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
TBGA,
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
5 ns
|
|
Additional Feature
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e1
|
|
Length
|
15 mm
|
|
Memory Density
|
8388608 bit
|
|
Memory IC Type
|
ZBT SRAM
|
|
Memory Width
|
32
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
262144 words
|
|
Number of Words Code
|
256000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
256KX32
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
13 mm
|
Alternate Parts for GS881Z32BGD-300T
This table gives cross-reference parts and alternative options found for GS881Z32BGD-300T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS881Z32BGD-300T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS881Z32BD-300T | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BD-300T |
| GS881Z32BD-300IT | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BD-300IT |
| GS881Z32BGD-300I | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BGD-300I |
| GS881Z32BGD-300IT | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BGD-300IT |
| GS881Z32BGD-300 | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BGD-300 |
| GS881Z32BD-300I | ZBT SRAM, 256KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS881Z32BGD-300T vs GS881Z32BD-300I |