Part Details for GS8672Q36BGE-200 by GSI Technology
Overview of GS8672Q36BGE-200 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8672Q36BGE-200
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
GS8672Q36BGE-200
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672Q36BGE-200) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ | |
DISTI #
464-GS8672Q36BGE-200
|
Mouser Electronics | SRAM RoHS: Compliant | 0 |
|
$101.6800 / $117.9500 | Order Now |
Part Details for GS8672Q36BGE-200
GS8672Q36BGE-200 CAD Models
GS8672Q36BGE-200 Part Data Attributes
|
GS8672Q36BGE-200
GSI Technology
Buy Now
Datasheet
|
Compare Parts:
GS8672Q36BGE-200
GSI Technology
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, BGA165,11X15,40 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 12 Weeks | |
Access Time-Max | 0.45 ns | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
Length | 17 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 1.1 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |
Alternate Parts for GS8672Q36BGE-200
This table gives cross-reference parts and alternative options found for GS8672Q36BGE-200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672Q36BGE-200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
K7R643682M-FC20T | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | GS8672Q36BGE-200 vs K7R643682M-FC20T |
GS8672Q36BGE-200T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672Q36BGE-200 vs GS8672Q36BGE-200T |
GS8662Q36BGD-200 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672Q36BGE-200 vs GS8662Q36BGD-200 |
CY7C1514AV18-200BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8672Q36BGE-200 vs CY7C1514AV18-200BZC |
K7R643682M-EC200 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | Samsung Semiconductor | GS8672Q36BGE-200 vs K7R643682M-EC200 |
IS61QDB22M36-200M3L | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8672Q36BGE-200 vs IS61QDB22M36-200M3L |
GS8662Q36BGD-200T | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672Q36BGE-200 vs GS8662Q36BGD-200T |
CY7C1514KV18-200BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8672Q36BGE-200 vs CY7C1514KV18-200BZC |