Part Details for GS8672D37BE-300I by GSI Technology
Overview of GS8672D37BE-300I by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS8672D37BE-300I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8672D37BE-300I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D37BE-300I) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
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RFQ | |
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DISTI #
464-GS8672D37BE-300I
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Mouser Electronics | SRAM | 0 |
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$111.8100 / $129.7100 | Order Now |
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DISTI #
GS8672D37BE-300I
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D37BE-300I) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ |
Part Details for GS8672D37BE-300I
GS8672D37BE-300I CAD Models
GS8672D37BE-300I Part Data Attributes:
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GS8672D37BE-300I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8672D37BE-300I
GSI Technology
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINE ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for GS8672D37BE-300I
This table gives cross-reference parts and alternative options found for GS8672D37BE-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672D37BE-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8672T37AGE-300T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8672T37AGE-300T |
| GS81302T37E-400T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS81302T37E-400T |
| GS8662T36E-250T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8662T36E-250T |
| GS8672T36BE-250IT | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8672T36BE-250IT |
| GS8662D36BGD-167T | Standard SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8662D36BGD-167T |
| CY7C1565KV18-550BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8672D37BE-300I vs CY7C1565KV18-550BZXC |
| IS61QDP2B42M36A-300M3LI | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8672D37BE-300I vs IS61QDP2B42M36A-300M3LI |
| GS8672T38AE-550IT | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8672T38AE-550IT |
| GS8672D36BGE-250T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8672D36BGE-250T |
| GS8672T38AE-500T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8672D37BE-300I vs GS8672T38AE-500T |