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Memory SRAMs GS8672D36BGE-250I

Memory
GS8672D36BGE-250I
GSI Technology
Description: Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Overview of GS8672D36BGE-250I by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
LTC2250IUH#PBF Analog Devices 10-B, 105Msps L N 3V ADCs
LTC2250IUH#TRPBF Analog Devices 10-B, 105Msps L N 3V ADCs

Price & Stock for GS8672D36BGE-250I by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS8672D36BGE-250I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D36BGE-250I) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8672D36BGE250I
Mouser Electronics SRAM RoHS: Compliant 0
  • 1 $129.7100
  • 10 $116.7800
  • 30 $114.2100
  • 60 $111.8100
$111.8100 / $129.7100 Order Now

CAD Models for GS8672D36BGE-250I by GSI Technology
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Part Data Attributes for GS8672D36BGE-250I by GSI Technology
Parametric Data

GS8672D36BGE-250I
GSI Technology
Buy Now
-
-
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA, BGA165,11X15,40
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Factory Lead Time
12 Weeks
Access Time-Max
0.45 ns
Additional Feature
PIPELINE ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
STANDARD SRAM
Memory Width
36
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Voltage-Min
1.7 V
Supply Current-Max
1.31 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
Want to compare parts?
  1. GS8672D36BGE-250I
    GSI Technology
    Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
    VS

Alternate Parts for GS8672D36BGE-250I

This table gives cross-reference parts and alternative options found for GS8672D36BGE-250I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672D36BGE-250I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C1515KV18-250BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8672D36BGE-250I vs CY7C1515KV18-250BZXI
GS8662D36BD-250I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8662D36BD-250I
CY7C1515KV18-250BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8672D36BGE-250I vs CY7C1515KV18-250BZI
Part Number Description Manufacturer Compare
GS8672D36BE-200I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672D36BE-200I
GS8672Q37BE-333I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672Q37BE-333I
GS8672D38BGE-550 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672D38BGE-550
GS8672T37BGE-300 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672T37BGE-300
IS61QDPB42M36A-550M3LI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8672D36BGE-250I vs IS61QDPB42M36A-550M3LI
GS81302T37GE-450I DDR SRAM, 2MX36, 0.37ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS81302T37GE-450I
GS8672D38BGE-550I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672D38BGE-550I
GS8672T36BGE-333 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672T36BGE-333
GS8672T38BGE-633 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672T38BGE-633
GS8672T37BE-375I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-250I vs GS8672T37BE-375I

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