Part Details for GS8662S09BGD-250I by GSI Technology
Overview of GS8662S09BGD-250I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8662S09BGD-250I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662S09BGD-250I
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Avnet Americas | GS8662S09BGD-250I - Trays (Alt: GS8662S09BGD-250I) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
464-GS8662S09BGD250I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 9 72M RoHS: Compliant | 0 |
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$60.1700 / $71.7900 | Order Now |
Part Details for GS8662S09BGD-250I
GS8662S09BGD-250I CAD Models
GS8662S09BGD-250I Part Data Attributes
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GS8662S09BGD-250I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662S09BGD-250I
GSI Technology
Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 8 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662S09BGD-250I
This table gives cross-reference parts and alternative options found for GS8662S09BGD-250I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662S09BGD-250I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662D09BD-300T | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662D09BD-300T |
GS8662D10BGD-300 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662D10BGD-300 |
GS8662Q10BD-300T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662Q10BD-300T |
CY7C1526V18-200BZC | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-250I vs CY7C1526V18-200BZC |
GS8662D11BGD-333T | Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662D11BGD-333T |
GS8662Q10BD-333IT | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662Q10BD-333IT |
CY7C1529V18-167BZXC | DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-250I vs CY7C1529V18-167BZXC |
CY7C1526JV18-300BZXC | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-250I vs CY7C1526JV18-300BZXC |
GS8662DT11BD-500IT | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-250I vs GS8662DT11BD-500IT |
CY7C1526JV18-250BZXI | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-250I vs CY7C1526JV18-250BZXI |