Part Details for GS8662R36BGD-300T by GSI Technology
Overview of GS8662R36BGD-300T by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 2SA1330(0)-T1B-A | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SA1330(0)-T1B-AT | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SB1300-T-AZ | Renesas Electronics Corporation | Bipolar Power Transistors |
Part Details for GS8662R36BGD-300T
GS8662R36BGD-300T CAD Models
GS8662R36BGD-300T Part Data Attributes
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GS8662R36BGD-300T
GSI Technology
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Datasheet
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GS8662R36BGD-300T
GSI Technology
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.625 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for GS8662R36BGD-300T
This table gives cross-reference parts and alternative options found for GS8662R36BGD-300T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662R36BGD-300T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| K7I643682M-EC300 | Samsung Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | GS8662R36BGD-300T vs K7I643682M-EC300 |
| GS8662R36BD-300 | GSI Technology | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GS8662R36BGD-300T vs GS8662R36BD-300 |
| K7I643682M-EC30T | Samsung Semiconductor | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | GS8662R36BGD-300T vs K7I643682M-EC30T |
| GS8672T36BGE-300 | GSI Technology | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | GS8662R36BGD-300T vs GS8672T36BGE-300 |
| CY7C1520V18-300BZI | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | GS8662R36BGD-300T vs CY7C1520V18-300BZI |
| CY7C1520AV18-300BZC | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | GS8662R36BGD-300T vs CY7C1520AV18-300BZC |
| CY7C1520V18-300BZC | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | GS8662R36BGD-300T vs CY7C1520V18-300BZC |
| GS8672T36BE-300T | GSI Technology | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | GS8662R36BGD-300T vs GS8672T36BE-300T |
| GS8662R36BGD-300 | GSI Technology | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GS8662R36BGD-300T vs GS8662R36BGD-300 |