Part Details for GS8662R08GE-300 by GSI Technology
Overview of GS8662R08GE-300 by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for GS8662R08GE-300
GS8662R08GE-300 CAD Models
GS8662R08GE-300 Part Data Attributes
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GS8662R08GE-300
GSI Technology
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Datasheet
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GS8662R08GE-300
GSI Technology
DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm |
Alternate Parts for GS8662R08GE-300
This table gives cross-reference parts and alternative options found for GS8662R08GE-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662R08GE-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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UPD44644084F5-E37-FQ1 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 | NEC Electronics Group | GS8662R08GE-300 vs UPD44644084F5-E37-FQ1 |
GS8662R08E-300 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08E-300 |
GS8662R08E-300I | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08E-300I |
GS8662R08GE-300T | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08GE-300T |
GS8662R08GE-300I | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08GE-300I |
GS8662R08E-300IT | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08E-300IT |
GS8662R08GE-300IT | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662R08GE-300 vs GS8662R08GE-300IT |