Part Details for GS8662D08E-167T by GSI Technology
Overview of GS8662D08E-167T by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for GS8662D08E-167T
GS8662D08E-167T CAD Models
GS8662D08E-167T Part Data Attributes
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GS8662D08E-167T
GSI Technology
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Datasheet
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GS8662D08E-167T
GSI Technology
DDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.5 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 167 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
Length | 17 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 235 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.575 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm |
Alternate Parts for GS8662D08E-167T
This table gives cross-reference parts and alternative options found for GS8662D08E-167T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662D08E-167T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1511V18-167BZC | QDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D08E-167T vs CY7C1511V18-167BZC |
GS8662D08GE-167 | DDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662D08E-167T vs GS8662D08GE-167 |
CY7C1511AV18-167BZXC | QDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D08E-167T vs CY7C1511AV18-167BZXC |
GS8662D08GE-167T | DDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662D08E-167T vs GS8662D08GE-167T |
CY7C1511AV18-167BZC | QDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D08E-167T vs CY7C1511AV18-167BZC |