Memory
GS8644Z18E-133IV
GSI Technology
Description: ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Overview of GS8644Z18E-133IV by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

Price & Stock for GS8644Z18E-133IV by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS8644Z18E-133IV
Avnet Americas SRAM Chip Sync Dual 1.8V/2.5V 72M-Bit 4M x 18 8.5ns/3.5ns 165-Pin FBGA Tray - Trays (Alt: GS8644Z18E-133IV) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 105 $146.8170
  • 210 $144.1476
  • 420 $137.0292
  • 630 $133.4700
  • 840 $129.0210
  • 1,050 $122.7924
  • 10,500 $119.2332
$119.2332 / $146.8170 Buy Now
DISTI # 464-GS8644Z18E-133IV
Mouser Electronics SRAM 1.8/2.5V 4M x 18 72M RoHS: Compliant 0
  • 15 $133.8100
  • 30 $133.4400
  • 60 $129.8500
$129.8500 / $133.8100 Order Now

CAD Models for GS8644Z18E-133IV by GSI Technology
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Part Data Attributes for GS8644Z18E-133IV by GSI Technology

GS8644Z18E-133IV
GSI Technology
-
-
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Active
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
8.5 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
ZBT SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX18
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
2 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
15 mm
Want to compare parts?
  1. GS8644Z18E-133IV
    GSI Technology
    ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
    VS

Alternate Parts for GS8644Z18E-133IV

This table gives cross-reference parts and alternative options found for GS8644Z18E-133IV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8644Z18E-133IV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
GS8644Z18E-133V ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8644Z18E-133IV vs GS8644Z18E-133V
GS8644Z18E-133IVT ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8644Z18E-133IV vs GS8644Z18E-133IVT
GS8644Z18E-133VT ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8644Z18E-133IV vs GS8644Z18E-133VT
Part Number Description Manufacturer Compare
GS864218GE-300T Cache SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology GS8644Z18E-133IV vs GS864218GE-300T
CY7C1472BV25-200AXCT ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 Infineon Technologies AG GS8644Z18E-133IV vs CY7C1472BV25-200AXCT
GS8642ZV18E-300I ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology GS8644Z18E-133IV vs GS8642ZV18E-300I
GS8641ZV18GF-300T ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 1 MM PITCH, LEAD FREE, FBGA-165 GSI Technology GS8644Z18E-133IV vs GS8641ZV18GF-300T
GS8641ZV18E-300T ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology GS8644Z18E-133IV vs GS8641ZV18E-300T
CY7C1472BV33-167BZXC ZBT SRAM, 4MX18, 3.4ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 Cypress Semiconductor GS8644Z18E-133IV vs CY7C1472BV33-167BZXC
GS8641V18GE-300T Cache SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology GS8644Z18E-133IV vs GS8641V18GE-300T
CY7C1473V33-150BZC ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165 Cypress Semiconductor GS8644Z18E-133IV vs CY7C1473V33-150BZC
CY7C1472BV25-200BZXC ZBT SRAM, 4MX18, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 Cypress Semiconductor GS8644Z18E-133IV vs CY7C1472BV25-200BZXC
CY7C1472V25-167BZXI ZBT SRAM, 4MX18, 3.4ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 Cypress Semiconductor GS8644Z18E-133IV vs CY7C1472V25-167BZXI

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