There are no models available for this part yet.
Overview of GS8641V32GE-200I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LT6200IS8-5#PBF | Analog Devices | 165MHz, R2R In & Out, 0.95nV/v | |
| LT6200IS6-10#TRMPBF | Analog Devices | 165MHz, R2R In & Out, 0.95nV/v | |
| LT6200IS8-5#TRPBF | Analog Devices | 165MHz, R2R In & Out, 0.95nV/v |
CAD Models for GS8641V32GE-200I by GSI Technology
Part Data Attributes for GS8641V32GE-200I by GSI Technology
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA,
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
7.5 ns
|
|
Additional Feature
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e1
|
|
Length
|
17 mm
|
|
Memory Density
|
67108864 bit
|
|
Memory IC Type
|
CACHE SRAM
|
|
Memory Width
|
32
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
2097152 words
|
|
Number of Words Code
|
2000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
2MX32
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.5 mm
|
|
Supply Voltage-Max (Vsup)
|
2 V
|
|
Supply Voltage-Min (Vsup)
|
1.6 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
15 mm
|
Alternate Parts for GS8641V32GE-200I
This table gives cross-reference parts and alternative options found for GS8641V32GE-200I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8641V32GE-200I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8641V32GE-200 | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32GE-200 |
| GS8641V32E-200I | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32E-200I |
| GS8641V32GE-200IT | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32GE-200IT |
| GS8641V32E-200 | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32E-200 |
| GS8641V32E-200IT | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32E-200IT |
| GS8641V32E-200T | Cache SRAM, 2MX32, 7.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | GS8641V32GE-200I vs GS8641V32E-200T |