There are no models available for this part yet.
Overview of GS8342S18BD-300 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 3 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 3 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS8342S18BD-300 by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS8342S18BD-300
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342S18BD-300) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$31.1148 / $38.3130 | Buy Now | |
|
DISTI #
464-GS8342S18BD-300
|
Mouser Electronics | SRAM 1.8 or 1.5V 2M x 18 36M RoHS: Not Compliant | 0 |
|
$32.9700 / $41.0700 | Order Now |
CAD Models for GS8342S18BD-300 by GSI Technology
Part Data Attributes for GS8342S18BD-300 by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA, BGA165,11X15,40
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.B
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
24 Weeks
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
|
I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
Length
|
15 mm
|
|
Memory Density
|
37748736 bit
|
|
Memory IC Type
|
DDR SRAM
|
|
Memory Width
|
18
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
2097152 words
|
|
Number of Words Code
|
2000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
2MX18
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.2 A
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.53 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
13 mm
|
Alternate Parts for GS8342S18BD-300
This table gives cross-reference parts and alternative options found for GS8342S18BD-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8342S18BD-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8342S18BGD-300 | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | GS8342S18BD-300 vs GS8342S18BGD-300 |
| GS8342S18BD-300T | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165 | GSI Technology | GS8342S18BD-300 vs GS8342S18BD-300T |
| GS8342S18BGD-300T | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | GS8342S18BD-300 vs GS8342S18BGD-300T |