There are no models available for this part yet.
Overview of GS8342D10BD-400IT by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 6 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for GS8342D10BD-400IT by GSI Technology
Part Data Attributes for GS8342D10BD-400IT by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA, BGA165,11X15,40
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
400 MHz
|
|
I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e0
|
|
Length
|
15 mm
|
|
Memory Density
|
37748736 bit
|
|
Memory IC Type
|
QDR SRAM
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Memory Width
|
9
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
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Number of Words
|
4194304 words
|
|
Number of Words Code
|
4000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
4MX9
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.235 A
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.715 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
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|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
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Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
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|
Width
|
13 mm
|
Alternate Parts for GS8342D10BD-400IT
This table gives cross-reference parts and alternative options found for GS8342D10BD-400IT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8342D10BD-400IT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8342D11BGD-400I | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D11BGD-400I |
| GS8342D11BGD-400IT | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D11BGD-400IT |
| GS8342D10BGD-400IT | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D10BGD-400IT |
| GS8342D10BGD-400I | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D10BGD-400I |
| GS8342D11BD-400IT | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D11BD-400IT |
| GS8342D10BD-400I | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, BGA-165 | GSI Technology | GS8342D10BD-400IT vs GS8342D10BD-400I |