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Memory / SRAMs / GS8322Z36AB-200
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GS8322Z36AB-200 by: GSI Technology

ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119

Part Details for GS8322Z36AB-200 by GSI Technology

Overview of GS8322Z36AB-200 by GSI Technology

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for GS8322Z36AB-200

Part # Distributor Description Stock Price Buy
DISTI # GS8322Z36AB-200
Avnet Americas SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 6.5ns/3ns 119-Pin F-BGA - Bulk (Alt: GS8322Z36AB-200) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 84 $37.4220
  • 168 $36.7416
  • 336 $34.9272
  • 504 $34.0200
  • 672 $32.8860
  • 840 $31.2984
  • 8,400 $30.3912
$30.3912 / $37.4220 Buy Now
DISTI # 464-GS8322Z36AB-200
Mouser Electronics SRAM 2.5 or 3.3V 1M x 36 32M RoHS: Not Compliant 0
  • 1 $40.1100
  • 10 $37.2000
  • 28 $35.8600
  • 56 $35.5400
  • 112 $32.0500
  • 252 $30.9800
$30.9800 / $40.1100 Order Now

Part Details for GS8322Z36AB-200

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GS8322Z36AB-200 Part Data Attributes

Parametric Data
GS8322Z36AB-200 GSI Technology
Buy Now Datasheet
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GS8322Z36AB-200 GSI Technology ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description BGA, BGA119,7X17,50
Pin Count 119
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 6.5 ns
Additional Feature ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 37748736 bit
Memory IC Type ZBT SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.99 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 2.3 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for GS8322Z36AB-200

This table gives cross-reference parts and alternative options found for GS8322Z36AB-200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8322Z36AB-200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8322Z36AB-200T ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS8322Z36AB-200T
GS8322Z36AGB-200T ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS8322Z36AGB-200T
Part Number Description Manufacturer Compare
GS832436B-150 Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology GS8322Z36AB-200 vs GS832436B-150
GS832436GB-225T Cache SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology GS8322Z36AB-200 vs GS832436GB-225T
GS8322Z36GB-150T ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS8322Z36GB-150T
GS8324Z36B-250IT ZBT SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology GS8322Z36AB-200 vs GS8324Z36B-250IT
K7N323645M-HC160 ZBT SRAM, 1MX36, 3.5ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor GS8322Z36AB-200 vs K7N323645M-HC160
GS8322Z36AGB-333IV ZBT SRAM, 1MX36, 5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS8322Z36AGB-333IV
K7P323666M-HC250 Late-Write SRAM, 1MX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Samsung Semiconductor GS8322Z36AB-200 vs K7P323666M-HC250
GS832236AB-300 Cache SRAM, 1MX36, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS832236AB-300
GS8322ZV36B-133 ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 PITCH, FPBGA-119 GSI Technology GS8322Z36AB-200 vs GS8322ZV36B-133
GS832436GB-150T Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology GS8322Z36AB-200 vs GS832436GB-150T

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