Part Details for GS8170LW18C-300 by GSI Technology
Overview of GS8170LW18C-300 by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Energy and Power Systems
Renewable Energy
Part Details for GS8170LW18C-300
GS8170LW18C-300 CAD Models
GS8170LW18C-300 Part Data Attributes
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GS8170LW18C-300
GSI Technology
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Datasheet
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GS8170LW18C-300
GSI Technology
Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 209 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 1.8 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B209 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 209 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS8170LW18C-300
This table gives cross-reference parts and alternative options found for GS8170LW18C-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8170LW18C-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8170LW18GC-300IT | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18GC-300IT |
| GS8170LW18GC-300 | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18GC-300 |
| GS8170LW18GC-300I | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18GC-300I |
| GS8170LW18C-300T | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18C-300T |
| GS8170LW18GC-300T | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18GC-300T |
| GS8170LW18C-300IT | Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170LW18C-300 vs GS8170LW18C-300IT |