Part Details for GS8170EW18C-300T by GSI Technology
Overview of GS8170EW18C-300T by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 2SA1330(0)-T1B-A | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SA1330(0)-T1B-AT | Renesas Electronics Corporation | Small Signal Bipolar Transistors | |
| 2SB1300-T-AZ | Renesas Electronics Corporation | Bipolar Power Transistors |
Part Details for GS8170EW18C-300T
GS8170EW18C-300T CAD Models
GS8170EW18C-300T Part Data Attributes
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GS8170EW18C-300T
GSI Technology
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Datasheet
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GS8170EW18C-300T
GSI Technology
Standard SRAM, 1MX18, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 209 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B209 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 209 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS8170EW18C-300T
This table gives cross-reference parts and alternative options found for GS8170EW18C-300T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8170EW18C-300T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8170EW18C-300 | Standard SRAM, 1MX18, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170EW18C-300T vs GS8170EW18C-300 |
| GS8170EW18C-300IT | Standard SRAM, 1MX18, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170EW18C-300T vs GS8170EW18C-300IT |