Part Details for GS81313HT18GK-550I by GSI Technology
Overview of GS81313HT18GK-550I by GSI Technology
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ISL1550IRZ-T13 | Renesas Electronics Corporation | Single Port, VDSL2 Differential Line Driver | |
| ISL1550IRZ | Renesas Electronics Corporation | Single Port, VDSL2 Differential Line Driver | |
| ISL1550IRZ-T7 | Renesas Electronics Corporation | Single Port, VDSL2 Differential Line Driver |
Price & Stock for GS81313HT18GK-550I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
464-81313HT18GK550I
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Mouser Electronics | SRAM RoHS: Compliant | 0 |
|
$279.8800 / $292.7400 | Order Now |
Part Details for GS81313HT18GK-550I
GS81313HT18GK-550I CAD Models
GS81313HT18GK-550I Part Data Attributes
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GS81313HT18GK-550I
GSI Technology
Buy Now
Datasheet
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GS81313HT18GK-550I
GSI Technology
DDR SRAM, 8MX18, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | HBGA, BGA260,13X20,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Clock Frequency-Max (fCLK) | 550 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B260 | |
| Length | 22 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA260,13X20,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.3 mm | |
| Standby Voltage-Min | 1.15 V | |
| Supply Voltage-Max (Vsup) | 1.35 V | |
| Supply Voltage-Min (Vsup) | 1.15 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |