Datasheets
GS81302T37GE-400I by: GSI Technology

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS81302T37GE-400I by GSI Technology

Overview of GS81302T37GE-400I by GSI Technology

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Price & Stock for GS81302T37GE-400I

Part # Distributor Description Stock Price Buy
DISTI # GS81302T37GE-400I
Avnet Americas SRAM Chip Sync Single 1.8V 144M-Bit 4M x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS81302T37GE-400I) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 105 $222.5520
  • 210 $218.5056
  • 420 $207.7152
  • 630 $202.3200
  • 840 $195.5760
$195.5760 / $222.5520 Buy Now
DISTI # 464-GS81302T37GE400I
Mouser Electronics SRAM RoHS: Compliant 0
  • 10 $201.3000
$201.3000 Order Now

Part Details for GS81302T37GE-400I

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GS81302T37GE-400I Part Data Attributes

GS81302T37GE-400I GSI Technology
Buy Now Datasheet
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GS81302T37GE-400I GSI Technology DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for GS81302T37GE-400I

This table gives cross-reference parts and alternative options found for GS81302T37GE-400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS81302T37GE-400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8130237E-400I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, BGA-165 GSI Technology GS81302T37GE-400I vs GS8130237E-400I
GS81302T37E-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS81302T37E-400IT
GS81302T37GE-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS81302T37GE-400
GS8130237E-400T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, BGA-165 GSI Technology GS81302T37GE-400I vs GS8130237E-400T
GS8130237GE-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-165 GSI Technology GS81302T37GE-400I vs GS8130237GE-400
GS81302T37E-400I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS81302T37E-400I
GS8130237GE-400T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-165 GSI Technology GS81302T37GE-400I vs GS8130237GE-400T
GS81302T37GE-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS81302T37GE-400IT
GS8130237E-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, BGA-165 GSI Technology GS81302T37GE-400I vs GS8130237E-400
GS81302T37E-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS81302T37E-400
Part Number Description Manufacturer Compare
GS8672Q36AGE-333T Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 GSI Technology GS81302T37GE-400I vs GS8672Q36AGE-333T
GS8672D37BE-400I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS8672D37BE-400I
IS61DDPB42M36A-500M3L DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS81302T37GE-400I vs IS61DDPB42M36A-500M3L
GS8672D36BE-333I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS8672D36BE-333I
K7J643682M-EI300 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 Samsung Semiconductor GS81302T37GE-400I vs K7J643682M-EI300
CY7C1565V18-333BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS81302T37GE-400I vs CY7C1565V18-333BZI
UPD44644365F5-E37-FQ1 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 NEC Electronics Group GS81302T37GE-400I vs UPD44644365F5-E37-FQ1
CY7C1565KV18-550BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS81302T37GE-400I vs CY7C1565KV18-550BZXI
GS8672T38BE-633 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS8672T38BE-633
GS8662S36BGD-167T Standard SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology GS81302T37GE-400I vs GS8662S36BGD-167T

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