Datasheets
FTE256S8N-20C by: Force Technologies Ltd

EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

Part Details for FTE256S8N-20C by Force Technologies Ltd

Overview of FTE256S8N-20C by Force Technologies Ltd

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Applications Energy and Power Systems Medical Imaging Robotics and Drones

Part Details for FTE256S8N-20C

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FTE256S8N-20C Part Data Attributes

FTE256S8N-20C Force Technologies Ltd
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FTE256S8N-20C Force Technologies Ltd EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer FORCE TECHNOLOGIES LTD
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A991.B.1.B.1
HTS Code 8542.32.00.51
Access Time-Max 200 ns
Data Polling YES
JESD-30 Code R-CDIP-T32
Length 41.91 mm
Memory Density 4194304 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Page Size 128 words
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 10.16 mm
Standby Current-Max 0.0012 A
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit NO
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for FTE256S8N-20C

This table gives cross-reference parts and alternative options found for FTE256S8N-20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FTE256S8N-20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT28C040-20BM EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BM
5962-9309105HYX EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 Mercury Systems Inc FTE256S8N-20C vs 5962-9309105HYX
FTE256S8N-20M EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd FTE256S8N-20C vs FTE256S8N-20M
AT28C040-20BC EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BC
AT28C040-20BM EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32 Microchip Technology Inc FTE256S8N-20C vs AT28C040-20BM
AT28C040-20BM/883 EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BM/883
5962-9309105HYC EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 Mercury Systems Inc FTE256S8N-20C vs 5962-9309105HYC
AT28C040-20BJSL703 EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32 Microchip Technology Inc FTE256S8N-20C vs AT28C040-20BJSL703
FTE256S8N-20I EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd FTE256S8N-20C vs FTE256S8N-20I
AT28C040-20BJSL703 EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BJSL703
Part Number Description Manufacturer Compare
AT28C040-20FJSL703 EEPROM, 512KX8, 200ns, Parallel, CMOS, CDFP32, CERAMIC, MO-115AA, FP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20FJSL703
5962-9309104HYC EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 Micross Components FTE256S8N-20C vs 5962-9309104HYC
FTE256S8N-20B EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd FTE256S8N-20C vs FTE256S8N-20B
AT28C040-20BC EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BC
5962-9309104HYA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 Micross Components FTE256S8N-20C vs 5962-9309104HYA
AT28C040-20BM/883 EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation FTE256S8N-20C vs AT28C040-20BM/883
5962-9309105HYC EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 Mercury Systems Inc FTE256S8N-20C vs 5962-9309105HYC
FTE512S8N-20M EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd FTE256S8N-20C vs FTE512S8N-20M
WE512K8-200CQ EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation FTE256S8N-20C vs WE512K8-200CQ
5962-9309105HYA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 White Microelectronics FTE256S8N-20C vs 5962-9309105HYA

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