Datasheets
FT6164L-35DWM by: Force Technologies Ltd

Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28

Part Details for FT6164L-35DWM by Force Technologies Ltd

Overview of FT6164L-35DWM by Force Technologies Ltd

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Applications Audio and Video Systems Transportation and Logistics Entertainment and Gaming Automotive

Part Details for FT6164L-35DWM

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FT6164L-35DWM Part Data Attributes

FT6164L-35DWM Force Technologies Ltd
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FT6164L-35DWM Force Technologies Ltd Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28
Part Life Cycle Code Active
Ihs Manufacturer FORCE TECHNOLOGIES LTD
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
Additional Feature LG-MAX
JESD-30 Code R-GDIP-T28
Length 37.846 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Seated Height-Max 5.8928 mm
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for FT6164L-35DWM

This table gives cross-reference parts and alternative options found for FT6164L-35DWM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FT6164L-35DWM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-3829427MZA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 LOGIC Devices Inc FT6164L-35DWM vs 5962-3829427MZA
P4C164L-35PMBLF Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs P4C164L-35PMBLF
5962-8552508XX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Integrated Device Technology Inc FT6164L-35DWM vs 5962-8552508XX
5962-3829453MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components FT6164L-35DWM vs 5962-3829453MZX
P4C164-35DWMBLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs P4C164-35DWMBLF
5962-3829427MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Electronic Designs Inc FT6164L-35DWM vs 5962-3829427MZX
MT5C6408-35LIT Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Micron Technology Inc FT6164L-35DWM vs MT5C6408-35LIT
HM3-65764H-5 Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, Temic Semiconductors FT6164L-35DWM vs HM3-65764H-5
P4C164-35CMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs P4C164-35CMLF
P4C164-35PMBLF Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs P4C164-35PMBLF
Part Number Description Manufacturer Compare
5962-8866208TX Standard SRAM, 32KX8, 15ns, CMOS, CDFP28, CERAMIC, FP-28 Micross Components FT6164L-35DWM vs 5962-8866208TX
5962-9318708H4X SRAM Module, 128KX32, 25ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66 White Microelectronics FT6164L-35DWM vs 5962-9318708H4X
5962-8685917UX Standard SRAM, 16KX4, 35ns, CMOS, 0.560 X 0.358 INCH, 0.075 HEIGHT, LCC-28 Cypress Semiconductor FT6164L-35DWM vs 5962-8685917UX
5962-9461108HMC Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68 Cobham Power Products FT6164L-35DWM vs 5962-9461108HMC
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, CERDIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs 5962-8552508XA
5962-9318701H4A SRAM Module, 128KX32, 120ns, CMOS, HIP-66 Microsemi Corporation FT6164L-35DWM vs 5962-9318701H4A
5962-3829454MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components FT6164L-35DWM vs 5962-3829454MZX
FT6264L-12FMB Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, CERAMIC, FLAT PACKAGE, 28 PIN Force Technologies Ltd FT6164L-35DWM vs FT6264L-12FMB
P4C164-35CI Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation FT6164L-35DWM vs P4C164-35CI
DPS128X32V3-85B SRAM Module, 512KX8, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc FT6164L-35DWM vs DPS128X32V3-85B

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