Part Details for FM93CS56EN by Fairchild Semiconductor Corporation
Overview of FM93CS56EN by Fairchild Semiconductor Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for FM93CS56EN
FM93CS56EN CAD Models
FM93CS56EN Part Data Attributes
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FM93CS56EN
Fairchild Semiconductor Corporation
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FM93CS56EN
Fairchild Semiconductor Corporation
EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | DIP, DIP8,.3 | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 1 MHz | |
Data Retention Time-Min | 40 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e0 | |
Length | 9.817 mm | |
Memory Density | 2048 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 128 words | |
Number of Words Code | 128 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128X16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Serial Bus Type | MICROWIRE | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.001 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm | |
Write Cycle Time-Max (tWC) | 10 ms | |
Write Protection | HARDWARE/SOFTWARE |