Part Details for FM1108-150DC by Ramtron International Corporation
Overview of FM1108-150DC by Ramtron International Corporation
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Applications
Consumer Electronics
Security and Surveillance
Internet of Things (IoT)
Financial Technology (Fintech)
Smart Cities
Healthcare
Medical Imaging
Part Details for FM1108-150DC
FM1108-150DC CAD Models
FM1108-150DC Part Data Attributes
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FM1108-150DC
Ramtron International Corporation
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FM1108-150DC
Ramtron International Corporation
Memory Circuit, 256X8, CMOS, CDIP24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RAMTRON INTERNATIONAL CORP | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 150 ns | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 2048 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 8 | |
Number of Terminals | 24 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256X8 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00004 A | |
Supply Current-Max | 0.016 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |