Part Details for ES29LV800EB-70TG by Excel (Suzhou) Semiconductor Co Ltd
Overview of ES29LV800EB-70TG by Excel (Suzhou) Semiconductor Co Ltd
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
0805HS-270TGLC | Coilcraft Inc | General Purpose Inductor, 0.027uH, 2%, 1 Element, Ceramic-Core, SMD, 0805, CHIP, 0805, ROHS COMPLIANT | |
1008HS-270TGLB | Coilcraft Inc | General Purpose Inductor, 0.027uH, 2%, 1 Element, Ceramic-Core, SMD, 1008, CHIP, 1008, ROHS COMPLIANT | |
0805HS-270TGLB | Coilcraft Inc | General Purpose Inductor, 0.027uH, 2%, 1 Element, Ceramic-Core, SMD, 0805, CHIP, 0805, ROHS COMPLIANT |
Part Details for ES29LV800EB-70TG
ES29LV800EB-70TG CAD Models
ES29LV800EB-70TG Part Data Attributes
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ES29LV800EB-70TG
Excel (Suzhou) Semiconductor Co Ltd
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Datasheet
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ES29LV800EB-70TG
Excel (Suzhou) Semiconductor Co Ltd
Flash, 512KX16, 70ns, PDSO48
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | EXCEL SEMICONDUCTOR INC | |
Package Description | TSSOP, TSSOP48,.8,20 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 70 ns | |
Alternate Memory Width | 8 | |
Boot Block | BOTTOM | |
Command User Interface | YES | |
Data Polling | YES | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G48 | |
Memory Density | 8388608 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Number of Sectors/Size | 1,2,1,15 | |
Number of Terminals | 48 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP48,.8,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Sector Size | 16K,8K,32K,64K | |
Standby Current-Max | 0.00001 A | |
Supply Current-Max | 0.03 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Toggle Bit | YES | |
Type | NOR TYPE |