Datasheets
EPF8820ABC225-4 by:

Loadable PLD, CMOS, PBGA225, BGA-225

Part Details for EPF8820ABC225-4 by Intel Corporation

Overview of EPF8820ABC225-4 by Intel Corporation

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Applications Computing and Data Storage

Price & Stock for EPF8820ABC225-4

Part # Distributor Description Stock Price Buy
DISTI # EPF8820ABC225-4
Avnet Americas FPGA FLEX 8000 Family 8K Gates 672 Cells 125MHz CMOS Technology 5V 225-Pin BGA - Bulk (Alt: EPF8820ABC225-4) RoHS: Not Compliant Min Qty: 8 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Bulk 130 Partner Stock
  • 1 $51.9900
  • 25 $48.5200
  • 25 $50.9500
  • 100 $46.5400
  • 1,000 $42.0900
$42.0900 / $51.9900 Buy Now

Part Details for EPF8820ABC225-4

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EPF8820ABC225-4 Part Data Attributes

EPF8820ABC225-4 Intel Corporation
Buy Now Datasheet
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EPF8820ABC225-4 Intel Corporation Loadable PLD, CMOS, PBGA225, BGA-225
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description BGA-225
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 357 MHz
JESD-30 Code S-PBGA-B225
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4
Number of I/O Lines 152
Number of Inputs 152
Number of Logic Cells 672
Number of Outputs 148
Number of Terminals 225
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 152 I/O
Output Function REGISTERED
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type LOADABLE PLD
Qualification Status Not Qualified
Seated Height-Max 2.3 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm

Alternate Parts for EPF8820ABC225-4

This table gives cross-reference parts and alternative options found for EPF8820ABC225-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPF8820ABC225-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EPF8820ABC225-4N Loadable PLD, CMOS, PBGA225, BGA-225 Intel Corporation EPF8820ABC225-4 vs EPF8820ABC225-4N
EPF8820ABC225-4 Loadable PLD, CMOS, PBGA225, BGA-225 Altera Corporation EPF8820ABC225-4 vs EPF8820ABC225-4
Part Number Description Manufacturer Compare
EPF8820RC208-2 Loadable PLD, CMOS, PQFP208, POWER, QFP-208 Altera Corporation EPF8820ABC225-4 vs EPF8820RC208-2
EPF8820ABC225-4N Loadable PLD, CMOS, PBGA225, BGA-225 Intel Corporation EPF8820ABC225-4 vs EPF8820ABC225-4N
EPF8820GC192-3 Loadable PLD, CMOS, CPGA192, CERAMIC, PGA-192 Altera Corporation EPF8820ABC225-4 vs EPF8820GC192-3
EPF8820AQI160-3 Loadable PLD, CMOS, PQFP160, PLASTIC, QFP-160 Altera Corporation EPF8820ABC225-4 vs EPF8820AQI160-3
EPF8820RI208-3 Loadable PLD, CMOS, PQFP208, HEAT SINK, RQFP-208 Altera Corporation EPF8820ABC225-4 vs EPF8820RI208-3
EPF8820BC225-3 Loadable PLD, CMOS, PBGA225, BGA-225 Altera Corporation EPF8820ABC225-4 vs EPF8820BC225-3
EPF8820ARC208-3N Loadable PLD, CMOS, PQFP208, HEAT SINK, POWER, QFP-208 Altera Corporation EPF8820ABC225-4 vs EPF8820ARC208-3N
EPF8820AQC208-3N Loadable PLD, CMOS, PQFP208, PLASTIC, QFP-208 Intel Corporation EPF8820ABC225-4 vs EPF8820AQC208-3N
EPF8820GI192-3 Loadable PLD, CMOS, CPGA192, PGA-192 Altera Corporation EPF8820ABC225-4 vs EPF8820GI192-3
EPF8820AQC208-4 Loadable PLD, CMOS, PQFP208, PLASTIC, QFP-208 Altera Corporation EPF8820ABC225-4 vs EPF8820AQC208-4

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