Part Details for EP2AGX125EF25C4 by Intel Corporation
Overview of EP2AGX125EF25C4 by Intel Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Part Details for EP2AGX125EF25C4
EP2AGX125EF25C4 CAD Models
EP2AGX125EF25C4 Part Data Attributes
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EP2AGX125EF25C4
Intel Corporation
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Datasheet
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EP2AGX125EF25C4
Intel Corporation
Field Programmable Gate Array,
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B572 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Number of CLBs | 4964 | |
Number of Inputs | 260 | |
Number of Logic Cells | 118143 | |
Number of Outputs | 260 | |
Number of Terminals | 572 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 4964 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA572,24X24,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 2.2 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm |