Part Details for EN71GL128B0-70CW by Eon Silicon Solution Inc
Overview of EN71GL128B0-70CW by Eon Silicon Solution Inc
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for EN71GL128B0-70CW
EN71GL128B0-70CW CAD Models
EN71GL128B0-70CW Part Data Attributes
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EN71GL128B0-70CW
Eon Silicon Solution Inc
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Datasheet
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EN71GL128B0-70CW
Eon Silicon Solution Inc
Flash, 8MX16, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-56
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | EON SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PBGA-B56 | |
| Length | 9 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 8MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 7 mm |